IPC 9703 PDF

Buy IPC 0 IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY from SAI Global. IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINE FOR SOLDER JOINT RELIABILITY. JS Published: Mar Status: Reaffirmed> May The client creates file into datadir with the permission Without write Enhancement: IPC file permission # Closed.

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Removing components can alter the mechanical response of the board, repositioning gages can result in irrelevant strain. However, it is ipcc to note that pro-active SGT can result ultimately in significant cost savings.

This information will enable companies to execute SGT in a standardized and consistent manner. View shipping rates and policies Average Customer Review: The primary issue is the increased stiffness of the lead-free solder alloys, which prevents the outer rows of solder balls from distributing as much stress to adjacent rows. Share your thoughts with other customers. With increased utilization of strain measurement in electronics manufacturing, different SGT methodologies have been developed.

Data are being accumulated by the industry on the reliability of components that are subjected to the higher soldering temperatures for SAC.

While the industry may never be able to fully eradicate solder-joint fractures, the use of SGT will help companies develop more robust manufacturing processes and increase product quality and reliability levels. Such baseline data can give component suppliers better estimates of end-use strain levels applied to devices. While BGA package and ioc system-design trends have decreased flexure tolerances, the switch to lead-free solder alloys has introduced fresh concerns.

Few leading fixture suppliers have embraced SGT as part of their product-validation process. Partial cracking, however, is not detected easily with non-destructive testing, and often appears only in field returns.


There also is a growing realization that fractures do not occur strictly on the manufacturing line. Board-flexure control using strain gage measurement has proven effective in preventing these occurrences, and continues to gain acceptance as a method to identify stressful processes during manufacturing, handling, testing and assembly. Explore the Ipx Gift Guide. Strain-related metrics provide component suppliers with a significant competitive advantage.

Strain Gage Testing: Standardization

There is a critical need for this test method, as designing test conditions that 7903 replicate these varied environments is becoming increasingly difficult. Higher soldering temperatures also can have an adverse ilc on the reliability of the PCB, inducing failure modes such as warpage, delamination and Cu-trace cracking.

These concerns demand that the bending and flexure of the PCB during assembly, test, handling and transportation, as well as actual product application, be characterized and controlled closely to safeguard the reliability of the lead-free PCBA interconnection.

Efforts to reduce the cost of testing will ease adoption by smaller companies. Board-flexure control using strain gage measurement has become an effective method for preventing these failures. Would you like to tell us about a lower price? To further complicate matters, a single component may be subjected to many distinct system environments, leading to confusion about component qualification testing.

Some capacitor vendors specify allowable strain limits. This standardization effort has allowed the creation of a central database of SGT results with the long-term goal of developing better test fixture, PCB layout and process setup methods and guidelines.

East Dane Designer Men’s Fashion. There is the need for more collaborative research on the topic of strain limits.


With SGT, board assemblers can expect increased production yields. In addition to isolating potentially problematic operations, SGT validates that processes are operating within allowable strain levels. Stacked rosette strain gage with pre-attached wires. However, before the industry can fully realize the benefits of SGT, there are more hurdles that should be overcome. Get 99703, free shipping with Amazon Prime.


IPC/JEDEC IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

Research is still on-going to assess whether SAC may be more ipx due to the formation of the interfacial intermetallics and the associated existence of Kirkendall voids near the interface. Aside from manufacturing characterization, SGT also can be used as a mechanical design-validation tool. This ranges from multiple high-acceleration shocks experienced 973 handheld devices to shipping-shock impulses on expensive enterprise infrastructure equipment. This standard 903 the development and application for shock testing to surface mount components on PCBs.

Of particular concern is the impact of lead-free solder i;c the reliability of PCBA interconnects. As awareness increases, it becomes obvious that SGT is a necessary tool for test-fixture vendors. Amazon Rapids Fun stories for kids on the go. AmazonGlobal Ship Orders Internationally. Amazon Inspire Digital Educational Resources. There’s a problem loading this menu right now. I’d like to read this book on Kindle Don’t have a Kindle?

Process steps with excessive strain are identified for optimization. As we approach the July lead-free deadline, the transition to lead-free processes continues to cause anxiety. Unfortunately, variations in methodology inhibit reliable data collection and prevent data comparison. Amazon Drive Cloud storage from Amazon.

ipcc Amazon Restaurants Food delivery from local restaurants. With the insight that this data provides, companies are better positioned to design and manufacture more mechanically reliable products.